Technical advantages

1）High-speed signal design and simulation platform; Light module from the initial rate of 155 MBPS to 400 Gbps rate of widespread use today, as the signal rate multiplication in the transmission link to dozens of Gbps, require the transmission link must have low insertion loss and high return loss, otherwise the signal transmission distortion can reduce light transmission module performance and cannot meet the requirements of customers, Therefore, it is very important to study and analyze the signal integrity of high-speed transmission link in the development and design stage. Core design and simulation platform for photoelectric has a high-speed signal and grasp the rich experience in design and simulation of high-speed signal, the signal link in research and development design phase front simulation, find out problems in front of the PCB board and optimizes, greatly improve the probability of successful research and development of the first samples, but also can shorten the development cycle and reduce development costs.

2）Heat dissipation design and simulation of optical module; The transmission performance of the laser chip in an optical module is closely related to the operating temperature. If the temperature of the laser chip is too high, the performance of the optical chip deteriorates. With the development of optical modules towards higher rates of 400Gbps and 800Gbps, DSP, driver and TIA chips with higher power consumption appear in the module circuit. In parallel with multiple channels, it is required to have smaller size of modules, and more modules are required to be integrated on the board of transmission equipment. All these have higher requirements on the heat dissipation design of optical modules. Core cooling design and simulation platform for photoelectric light module, can fully in research and development design phase analysis of heat and cooling path, by optimizing the structure, adopting appropriate cooling auxiliary materials, design reasonable heat dissipation path, ensure that the internal heat of sufficient light module transmission to the outside of the module of heat dissipation, ensure the laser chip work under the best performance of the temperature.

3）Sub-micron high precision SMT packaging platform; The high-precision patch packaging platform can ensure that the packaged products are closer to the requirements of R&D and design, and ensure the performance and reliability of products.

4）High-speed optical chip testing platform; The chip-level test platform can quickly test the performance of the laser chip before it is packaged into components and modules. The test results can better guide and optimize the optical module design, and better ensure the probability of successful development of the first version of the sample.

5）Independently develop efficient multi-channel optical module commissioning system; The system can meet the requirements of different customers for parameter testing. The commissioning time of a single optical module can be reduced to 12 seconds, greatly improving production efficiency and ensuring delivery.